Bergquist Hi-Flow 650P 自粘 电子散热垫 HF650P-0.001-01-00-54, 1.5W/m·K, 0.001in厚

Hi-Flow 650P

Hi-Flow? 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow? 650P offers high temperature reliability ideal for automotive applications. Hi-Flow? 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.

Thermal Impedance: 0.20°C-in2/W (@25 psi)
150°C high temperature reliability
Natural tack one side for ease of assembly
Exceptional thermal performance in an insulated pad