双扁形无铅封装
MSL 1 级合乎 J-STD-020
薄型 1 mm 固定高度
小尺寸 4 mm x 4 mm 尺寸 50% 板可节省 SOIC 封装
Power at 70°C | 50mW (Individual), 400mW (Total) |
Maximum Operating Voltage | 50V |
Dimensions (L x W x H) | 4 x 4 x 0.85 mm |
Lead Pitch | 0.8 mm |
Resistance Tolerance | 0.1 % |
Absolute Temperature Coefficient | 25 ppm/°C |
Tracking Temperature Coefficient | 5 ppm/°C |
Operating Temperature | -55 → 125 °C |