CEM3,1.5 mm 实验室卡
热镀锡(HAL 无铅)
Type | RE210-S1 | RE210-S2 |
Size: | 100 x 160 mm | 100 x 220 mm |
Copper lamination: | 35 μm / one-side | 35 μm / one-side |
Soldering islands: | 38 x 61 / ? 2.2 mm | 38 x 85 / ? 2.2 mm |
Hole pattern: | 2.54x2.54mm | 2.54x2.54mm |
Hole ?: | 1 mm | 1 mm |
类型 | RE210-S1 | RE210-S2 | RE210-S3 |
尺寸: | 100 x 160 mm | 100 x 220 mm | 100 x 580 mm |
铜叠层: | 35 μm /一面 | 35 μm /一面 | 35 μm /一面 |
焊接区: | 38 x 61 / 直径 2.2 mm | 38 x 85 / 直径 2.2 mm | 38 x 227 / 直径 2.2 mm |
孔模式: | 2.54x2.54mm | 2.54x2.54mm | 2.54x2.54mm |
孔 ?: | 1 mm | 1 mm | 1 mm |
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